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Low Expansion Copper Tungsten Alloy Heat Sink ISO / RoHs Approval

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Zhuzhou Teyou New Material Co.,Ltd

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Low Expansion Copper Tungsten Alloy Heat Sink ISO / RoHs Approval

Brand Name : TY

Model Number : At customer's requested

Certification : ISO, RoHs

Place of Origin : China

MOQ : 5 kgs

Price : 1-100usd

Payment Terms : T/T, Western Union,paypal

Supply Ability : 5 tons per month

Delivery Time : 3-35 days

Packaging Details : wooden case

Materia : WCu

Product Standard : ASTM B 702

Class : W50/Cu50 - W90/Cu10

Density : 11.85 - 16.75

Brand : TY

Application : microelectronic components

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WCu Copper Tungsten AlloyTungsten Copper Heat Sink with 10-50 wt.% Cu

Description:

Tungsten copper heat sink is used for transferring heat generated in microelectronic components to prevent thermal damage.

Tungsten copper heat sink is a composite of tungsten and copper, so both the thermal advantages of copper and the very low expansion characteristics of tungsten can be adjusted to meet different requirements.

Application:

They are extensively used as thermal mounting plates, chip carriers, tungsten copper flanges, and frames for RF, light emitting diodes and detectors, laser diode packages like pulse, single emitter, bars and complex carriers for optoelectronics amplifiers, receivers, transmitters, tunable lasers, etc.

Advantages:

1. High thermal conductivity

2. Excellent hermeticity

3. Excellent flatness, surface finish, and size control

Product Properties:

Grade	W Content	Density g/cm³	Coefficient of thermal Expansion ×10^-6(20℃)	Thermal conductivity W/(M·K)
90WCu	90±2%	17.0	6.5	180 (25℃) /176 (100℃)
85WCu	85±2%	16.4	7.2	190 (25℃) / 183 (100℃)
80WCu	80±2%	15.65	8.3	200 (25℃) / 197 (100℃)
75WCu	75±2%	14.9	9.0	230 (25℃) / 220 (100℃)
50WCu	50±2%	12.2	12.5	340 (25℃) / 310 (100℃)

Product Tags:

tungsten heavy alloy

tungsten alloy

Low Expansion Copper Tungsten Alloy Heat Sink ISO / RoHs Approval Images

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